Package Design Engineer

Be visionary

Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.

We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.

About the Company

You may not realize it, but Teledyne enables many of the products and services you use every day. Teledyne provides enabling technologies to sense, transmit and analyze information for industrial growth markets, including aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, energy, medical imaging and pharmaceutical research.

Position

Teledyne e2v is recruiting a Package Design Engineer . This position can be based at our Saint‑Egrève site (near Grenoble, France) or at Teledyne Anafocus in Seville (Spain).

Teledyne e2v Semiconductors SAS , based in Saint‑Egrève (near Grenoble) has been a recognized semiconductor specialist for more than 70 years. Our 400‑employee site brings together research and development teams, production workshops, and support functions for two main business areas:

• Machine Vision Sensors (MVS) for image sensors, dental sensors, and cameras.
• High-Performance and High-Reliability semiconductor products: microprocessors, memories and high‑speed data converters.

Teledyne Anafocus , located in the Seville Tech Park, is a center of excellence in CMOS image sensor and vision‑on‑chip design, with a highly skilled engineering team and a strong innovation culture. Now fully integrated within Teledyne e2v, the site develops next‑generation imaging technologies for industrial, scientific, medical and surveillance applications.

Responsibilities

The Package Design Engineer leads the complete design flow of advanced microelectronic packages—translating customer needs into technical specifications, defining the solution, and ensuring successful routing and design reviews.

As the key technical interface, the Package Design Engineer works closely with packaging vendors and assembly houses throughout the project lifecycle. The role also involves monitoring emerging technologies and leading R&D or continuous‑improvement initiatives to shape future generations of imaging packages.

What You’ll Do

• Identify customers’ needs.
• Devise a solution and a specification.
• Interact with packaging manufacturers to obtain a solution and a quote throughout the design process.
• Interact with project teams (sensor designers, project manager…).
• Implement the design + routing of the package in accordance with the constraints and timing as originally defined.
• Conduct electrical, thermal and mechanical simulations when necessary.
• Conduct DRC checks in accordance with e2v methodologies.
• Conduct different design reviews including the final one before ordering the package.
• Assume the role of design expert with respect to assembly houses (assembly instructions…)

Ensure technical interface with package vendors and assembly houses:

• Guide technical reviews with package vendors.
• Technical identification and evaluation of new vendors.

Technology monitoring:

• Maintain a technology watch on future generations of imaging packages.
• Identify and lead R&D or continuous improvement projects on these technologies.

Qualifications

• Background in microelectronics, electronics (preferred), material science or micromechanics.
• First confirmed experience in packaging design.
• Specific experience in imaging and/or assembly would be a serious plus.
• Mastering of package design flow: specification, identifying solutions, design, validation.
• Mastering packaging layout meeting signal/power integrity aspects (under Cadence APD or equivalent).
• Knowledge of basic mechanical design (Solidworks or equivalent).
• Experience in technical management of package vendors and assembly houses.

A strong advantage would be

• Knowledge in electrical modelisation (parasitic extraction under Cadence Xtract IM, Spice, Ansys).
• Knowledge in thermal simulations (Ansys Workbench, Solidworks).
• Experience in system and sub‑system development.

Language requirements: Good level of English (B2 minimum) and French both oral and written. Spanish would be a plus.

Benefits

At Teledyne e2v, you join a team where innovation, human values and work‑life balance come together. You will work on cutting‑edge technological projects with high impact, in an innovation‑driven environment in the Grenoble ecosystem. You will have a structured onboarding program with a dedicated mentor and enjoy a flexible environment with teleworking agreement and real work‑life balance. The company is committed to QHSE/CSR goals (2025–2030), gender equality, and supporting social initiatives. The Alpine environment offers excellent quality of life.

Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders.