Senior Thermal Engineer

Job Description

Our partner is looking for a Senior Thermal Engineer to own the thermal architecture for advanced compute hardware, from die and package level analysis through liquid cooling, sled design and rack level heat rejection.

This is a senior individual contributor role with strong technical ownership. You will define thermal budgets, cooling requirements and validation methods, working closely with mechanical, power and hardware teams.

Location: Barcelona, Spain, Hybrid
Level: Senior

Responsibilities

• Own thermal design from silicon to rack level

• Define thermal budgets for high power compute hardware

• Model die hotspots, package spreading and board level thermal behaviour

• Run CFD and conjugate heat transfer simulations

• Perform transient analysis using realistic workload power profiles

• Design cold plates, manifolds and liquid cooling loops

• Define flow rate, pressure drop and coolant requirements

• Specify TIM stack, bond line and thermal interface requirements

• Define sled and rack thermal architecture

• Set coolant distribution, redundancy and failure response requirements

• Own thermal validation on real hardware

• Correlate simulation results with sensor and test measurements

• Work with mechanical, power and cooling partners

• Support thermal telemetry, throttling and power management decisions

Requirements

• 8+ years of electronics thermal engineering experience

• Background in high power computing, data centres or similar electronics

• Thermal ownership of processors, GPUs, ASICs or FPGAs

• Strong package level thermal analysis

• Strong CFD and thermal simulation experience

• Icepak, Flotherm, Star CCM+ or equivalent

• Liquid cooling and cold plate design

• Flow and pressure budget experience

• TIM selection and bond line knowledge

• Thermal interface reliability understanding

• Practical thermal validation experience

• Strong simulation to measurement correlation skills

Optional / Desired

• 2.5D, interposer or chiplet thermal design

• Two phase cooling

• Immersion cooling

• Direct to chip cooling

• OCP rack cooling experience

• Facility water interface design

• Electro thermal simulation

• Power delivery or PDN collaboration

• Python for automation and test analysis

What’s in it for you?

• Flexible working hours

• Hybrid model, 4 days office, 1 day from home

• 1 week per year working from anywhere

• 25 days annual leave plus December 24 and 31

• Monthly food allowance

• Private medical insurance

• Relocation bonus

• Housing search support

• Visa support if required

• Family relocation support

• Virtual shares

• Language classes

• Tax incentive, subject to eligibility